Report date: Nov 6,2024
Conflict count: 361874
Publisher: Sage Publications  - Technomic Publishing Company
Title count: 9
Conflict count: 161


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Created: 2017-07-03 09:12:22
ConfID: 5267568
CauseID: 1408601161
OtherID: 6235
JT: Journal of Thermal Envelope and Building Science
MD: ROELS,23,1,17,1999,Simulating Non-Isothermal Water Vapour Transfer: An Experimental Validation on Multi-Layered Building Components
DOI: 10.1106/T0YY-CKA8-JMDX-FHEB(Journal) (5267568-N)
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Created: 2017-07-03 09:12:22
ConfID: 5267569
CauseID: 1408601161
OtherID: 6235
JT: Journal of Thermal Envelope and Building Science
MD: STRAUBE,23,1,41,1999,Rain Control and Design Strategies
DOI: 10.1106/XVJ7-XNGB-7WDQ-DY0U(Journal) (5267569-N)
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Created: 2017-07-03 09:12:22
ConfID: 5267570
CauseID: 1408601161
OtherID: 6235
JT: Journal of Thermal Envelope and Building Science
MD: EDGAR,23,1,57,1999,Performance of Source Drainage External Insulation Finish System at the Window/Wall Junction
DOI: 10.1106/A2WU-6HLJ-KAH8-TQU6(Journal) (5267570-N)
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Created: 2017-07-03 09:12:21
ConfID: 5267564
CauseID: 1408601152
OtherID: 6235
JT: Journal of Thermal Envelope and Building Science
MD: BUDAIWI,23,2,123,1999,Impact of Indoor Air Conditions and Solar Radiation on Moisture Accumulation within Multi-Layer Non-Cavity Walls
DOI: 10.1106/PFCF-1L2D-W5XA-J97F(Journal) (5267564-N)
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Created: 2017-07-03 09:12:21
ConfID: 5267565
CauseID: 1408601152
OtherID: 6235
JT: Journal of Thermal Envelope and Building Science
MD: KOSSECKA,23,2,145,1999,Method of Averages to Determine Insulation Conductivity under Transient Conditions
DOI: 10.1106/P42L-43AV-2EQ4-TCLK(Journal) (5267565-N)
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Created: 2017-07-03 09:12:21
ConfID: 5267566
CauseID: 1408601152
OtherID: 6235
JT: Journal of Thermal Envelope and Building Science
MD: SWINTON,23,2,173,1999,In situ Performance of Expanded Molded Polystyrene in the Exterior Basement Insulation Systems (EIBS)
DOI: 10.1106/LTQF-BUT9-K823-L8P4(Journal) (5267566-N)
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Created: 2017-07-03 09:12:22
ConfID: 5267567
CauseID: 1408601161
OtherID: 6235
JT: Journal of Thermal Envelope and Building Science
MD: Bomberg,23,1,4,1999,LETTER FROM THE EDITOR
DOI: 10.1106/X6CB-99XB-R8LE-QKFA(Journal) (5267567-N)
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Created: 2017-07-03 10:18:42
ConfID: 5267650
CauseID: 1408607270
OtherID: 6235
JT: Journal of Thermal Envelope and Building Science
MD: ,24,1,3,2000,The Duty of Civility
DOI: 10.1106/TM41-FC2R-KUU7-GK9W(Journal) (5267650-N)
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Created: 2017-07-03 10:18:42
ConfID: 5267651
CauseID: 1408607270
OtherID: 6235
JT: Journal of Thermal Envelope and Building Science
MD: KATSMAN,24,1,10,2000,Model for Moisture-Content Evolution in Porous Building Elements with Hygro-Thermal Bridges and Air-Voids
DOI: 10.1106/FDJ1-FA5L-E3LB-BDHX(Journal) (5267651-N)
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Created: 2017-07-03 10:18:42
ConfID: 5267652
CauseID: 1408607270
OtherID: 6235
JT: Journal of Thermal Envelope and Building Science
MD: HOKOI,24,1,42,2000,Freezing-Thawing Processes in Glass Fiber Board
DOI: 10.1106/4TYA-DVWC-XUUY-B3WE(Journal) (5267652-N)
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Created: 2022-10-25 10:22:45
ConfID: 6663045
CauseID: 1546021856
OtherID: 6235
JT: Journal of Thermal Envelope and Building Science
MD: JANINSKA,23,4,339,2000,Environmental Requirements for Fungi
DOI: 10.1106/8CDT-BE1H-1R1T-CJJX(Journal) (6663045-N)
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Created: 2022-10-25 10:22:45
ConfID: 6663044
CauseID: 1546021856
OtherID: 6235
JT: Journal of Thermal Envelope and Building Science
MD: MAILVAGANAM,23,4,349,2000,Procedural Sequence in the Repair of Buildings
DOI: 10.1106/Q55E-P8G3-5PHW-3PG6(Journal) (6663044-N)
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Created: 2022-10-25 10:22:45
ConfID: 6663047
CauseID: 1546021856
OtherID: 6235
JT: Journal of Thermal Envelope and Building Science
MD: PETRIE,23,4,292,2000,Effects of Mechanical Fasteners and Gaps between Insulation Boards on Thermal Performance of Low-Slope Roofs
DOI: 10.1106/FWPW-3891-JMFG-19GL(Journal) (6663047-N)
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Created: 2022-10-25 10:22:46
ConfID: 6663053
CauseID: 1546021859
OtherID: 6235
JT: Journal of Thermal Envelope and Building Science
MD: ,23,3,205,2000,The Elements of Folly
DOI: 10.1106/FGVD-NGKQ-WM2J-66H4(Journal) (6663053-N)
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Created: 2022-10-25 10:22:46
ConfID: 6663052
CauseID: 1546021859
OtherID: 6235
JT: Journal of Thermal Envelope and Building Science
MD: ,23,3,212,2000,Epilogue to the 10th Symposium of Building Physics, 1999, in Dresden
DOI: 10.1106/XEDY-M2FV-80LV-RB47(Journal) (6663052-N)
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Created: 2022-10-25 10:22:46
ConfID: 6663054
CauseID: 1546021859
OtherID: 6235
JT: Journal of Thermal Envelope and Building Science
MD: Bomberg,23,3,202,2000,LETTER FROM THE EDITOR
DOI: 10.1106/4RXY-G6LE-2JMJ-100G(Journal) (6663054-N)
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Created: 2022-10-25 10:22:45
ConfID: 6663049
CauseID: 1546021856
OtherID: 6235
JT: Journal of Thermal Envelope and Building Science
MD: ,23,4,285,2000,Where Have All the Heroes Gone?
DOI: 10.1106/NPA2-PCFK-Q0WT-WNU3(Journal) (6663049-N)
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Created: 2022-10-25 10:22:46
ConfID: 6663048
CauseID: 1546021859
OtherID: 6235
JT: Journal of Thermal Envelope and Building Science
MD: BOMBERG,23,3,244,2000,On Variability in Physical Properties of Molded, Expanded Polystyrene
DOI: 10.1106/MGP7-JNCE-WF6K-R1EX(Journal) (6663048-N)
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Created: 2022-10-25 10:22:46
ConfID: 6663051
CauseID: 1546021859
OtherID: 6235
JT: Journal of Thermal Envelope and Building Science
MD: ,23,3,217,2000,Report from CMHC: Drying of Stucco-Clad Walls (Vancouver)
DOI: 10.1106/KJDF-A97C-PDGY-W2FH(Journal) (6663051-N)
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Created: 2022-10-25 10:22:46
ConfID: 6663050
CauseID: 1546021859
OtherID: 6235
JT: Journal of Thermal Envelope and Building Science
MD: GEVING,23,3,224,2000,Hygrothermal Analysis of Building Structures Using Computer Models
DOI: 10.1106/9NKL-BWKY-0LEL-B1AV(Journal) (6663050-N)