Report date: Nov 6,2024
Conflict count: 361874
Publisher: SAGE Publications
Title count: 532
Conflict count: 30231


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Created: 2017-07-03 08:40:50
ConfID: 5267432
CauseID: 1408594783
OtherID: 17601906
JT: Journal of Thermal Envelope and Building Science
MD: Carmeliet,25,3,209,2002,Determination of the Moisture Capacity of Porous Building Materials
DOI: 10.1177/0075424202025003835(Journal) (5267432-N)
DOI: 10.1106/109719602022835(Journal)
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Created: 2017-07-03 09:12:22
ConfID: 5267568
CauseID: 1408601161
JT: Journal of Thermal Envelope and Building Science
MD: Roels,23,1,17,1999,Simulating Non-Isothermal Water Vapour Transfer: An Experimental Validation on Multi-Layered Building Components
DOI: 10.1177/109719639902300104(Journal) (5267568-N)
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Created: 2017-07-03 09:12:22
ConfID: 5267569
CauseID: 1408601161
JT: Journal of Thermal Envelope and Building Science
MD: Straube,23,1,41,1999,Rain Control and Design Strategies
DOI: 10.1177/109719639902300105(Journal) (5267569-N)
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Created: 2017-07-03 09:12:22
ConfID: 5267570
CauseID: 1408601161
JT: Journal of Thermal Envelope and Building Science
MD: Edgar,23,1,57,1999,Performance of Source Drainage External Insulation Finish System at the Window/Wall Junction
DOI: 10.1177/109719639902300106(Journal) (5267570-N)
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Created: 2017-07-03 09:12:21
ConfID: 5267564
CauseID: 1408601152
JT: Journal of Thermal Envelope and Building Science
MD: Budaiwi,23,2,123,1999,Impact of Indoor Air Conditions and Solar Radiation on Moisture Accumulation within Multi-Layer Non-Cavity Walls
DOI: 10.1177/109719639902300203(Journal) (5267564-N)
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Created: 2017-07-03 09:12:21
ConfID: 5267565
CauseID: 1408601152
JT: Journal of Thermal Envelope and Building Science
MD: Kossecka,23,2,145,1999,Method of Averages to Determine Insulation Conductivity under Transient Conditions
DOI: 10.1177/109719639902300204(Journal) (5267565-N)
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Created: 2017-07-03 09:12:21
ConfID: 5267566
CauseID: 1408601152
JT: Journal of Thermal Envelope and Building Science
MD: Swinton,23,2,173,1999,In situ Performance of Expanded Molded Polystyrene in the Exterior Basement Insulation Systems (EIBS)
DOI: 10.1177/109719639902300206(Journal) (5267566-N)
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Created: 2017-07-03 09:12:22
ConfID: 5267567
CauseID: 1408601161
JT: Journal of Thermal Envelope and Building Science
MD: Bomberg,23,1,4,1999,Letter From the Editor
DOI: 10.1177/109719639902300101(Journal) (5267567-N)
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Created: 2017-07-03 10:18:42
ConfID: 5267650
CauseID: 1408607270
JT: Journal of Thermal Envelope and Building Science
MD: ,24,1,3,2000,The Duty of Civility
DOI: 10.1177/109719630002400101(Journal) (5267650-N)
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Created: 2017-07-03 10:18:42
ConfID: 5267651
CauseID: 1408607270
JT: Journal of Thermal Envelope and Building Science
MD: Katsman,24,1,10,2000,Model for Moisture-Content Evolution in Porous Building Elements with Hygro-Thermal Bridges and Air-Voids
DOI: 10.1177/109719630002400102(Journal) (5267651-N)
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Created: 2017-07-03 10:18:42
ConfID: 5267652
CauseID: 1408607270
JT: Journal of Thermal Envelope and Building Science
MD: Hokoi,24,1,42,2000,Freezing-Thawing Processes in Glass Fiber Board
DOI: 10.1177/109719630002400103(Journal) (5267652-N)
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Created: 2017-07-03 10:11:47
ConfID: 5267636
CauseID: 1408605909
OtherID: 34542100
JT: Journal of Thermal Envelope and Building Science
MD: Iwamae,27,2,123,2003,The Humidity Variation in Crawl Spaces of Japanese Houses
DOI: 10.1177/109719603032801(Journal) (5267636-N)
DOI: 10.1177/1097196303032801(Journal)
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Created: 2017-07-03 10:11:47
ConfID: 5267637
CauseID: 1408605909
OtherID: 34542100
JT: Journal of Thermal Envelope and Building Science
MD: Roux,27,2,135,2003,Radiative Properties of High and Low Density Fiberglass Insulation in the 4-38.5 km Wavelength Region
DOI: 10.1177/109719603035236(Journal) (5267637-N)
DOI: 10.1177/1097196303035236(Journal)
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Created: 2017-07-03 10:11:47
ConfID: 5267638
CauseID: 1408605909
OtherID: 34542100
JT: Journal of Thermal Envelope and Building Science
MD: Cornick,27,2,151,2003,A Moisture Index to Characterize Climates for Building Envelope Design
DOI: 10.1177/109719603036210(Journal) (5267638-N)
DOI: 10.1177/1097196303036210(Journal)
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Created: 2022-10-25 10:22:45
ConfID: 6663045
CauseID: 1546021856
JT: Journal of Thermal Envelope and Building Science
MD: Janinska,23,4,339,2000,Environmental Requirements for Fungi
DOI: 10.1177/174425910002300404(Journal) (6663045-N)
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Created: 2022-10-25 10:22:45
ConfID: 6663044
CauseID: 1546021856
JT: Journal of Thermal Envelope and Building Science
MD: Mailvaganam,23,4,349,2000,Procedural Sequence in the Repair of Buildings
DOI: 10.1177/174425910002300405(Journal) (6663044-N)
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Created: 2022-10-25 10:22:45
ConfID: 6663047
CauseID: 1546021856
JT: Journal of Thermal Envelope and Building Science
MD: Petrie,23,4,292,2000,Effects of Mechanical Fasteners and Gaps between Insulation Boards on Thermal Performance of Low-Slope Roofs
DOI: 10.1177/174425910002300402(Journal) (6663047-N)
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Created: 2022-10-25 10:22:46
ConfID: 6663053
CauseID: 1546021859
JT: Journal of Thermal Envelope and Building Science
MD: ,23,3,205,2000,The Elements of Folly
DOI: 10.1177/174425910002300303(Journal) (6663053-N)
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Created: 2022-10-25 10:22:46
ConfID: 6663052
CauseID: 1546021859
JT: Journal of Thermal Envelope and Building Science
MD: ,23,3,212,2000,Epilogue to the 10th Symposium of Building Physics, 1999, in Dresden
DOI: 10.1177/174425910002300304(Journal) (6663052-N)
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Created: 2022-10-25 10:22:46
ConfID: 6663054
CauseID: 1546021859
JT: Journal of Thermal Envelope and Building Science
MD: Bomberg,23,3,202,2000,Letter from the Editor
DOI: 10.1177/174425910002300301(Journal) (6663054-N)
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Created: 2022-10-25 10:22:45
ConfID: 6663049
CauseID: 1546021856
JT: Journal of Thermal Envelope and Building Science
MD: ,23,4,285,2000,Where Have All the Heroes Gone?
DOI: 10.1177/174425910002300401(Journal) (6663049-N)
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Created: 2022-10-25 10:22:46
ConfID: 6663048
CauseID: 1546021859
JT: Journal of Thermal Envelope and Building Science
MD: Bomberg,23,3,244,2000,On Variability in Physical Properties of Molded, Expanded Polystyrene
DOI: 10.1177/174425910002300307(Journal) (6663048-N)
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Created: 2022-10-25 10:22:46
ConfID: 6663051
CauseID: 1546021859
JT: Journal of Thermal Envelope and Building Science
MD: ,23,3,217,2000,Report from CMHC: Drying of Stucco-Clad Walls (Vancouver)
DOI: 10.1177/174425910002300305(Journal) (6663051-N)
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Created: 2022-10-25 10:22:46
ConfID: 6663050
CauseID: 1546021859
JT: Journal of Thermal Envelope and Building Science
MD: Geving,23,3,224,2000,Hygrothermal Analysis of Building Structures Using Computer Models
DOI: 10.1177/174425910002300306(Journal) (6663050-N)