Report date: Jan 21,2025
Conflict count: 358585
Publisher: Institute of Electrical and Electronics Engineers
Title count: 27
Conflict count: 278


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Created: 2024-12-19 14:18:01
ConfID: 7741924
CauseID: 1661770598
OtherID: 1661770594
JT: IEEE Transactions on Electromagnetic Compatibility
MD: ,66,6,1,2024,Table of Contents
DOI: 10.1109/TEMC.2024.3504882(Journal) (7741924-N)
DOI: 10.1109/TEMC.2024.3504873(Journal)
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Created: 2024-12-19 14:18:00
ConfID: 7741906
CauseID: 1661770594
OtherID: 1661770598
JT: IEEE Transactions on Electromagnetic Compatibility
MD: ,66,6,4,2024,Institutional Listings
DOI: 10.1109/TEMC.2024.3504888(Journal) (7741906-N)
DOI: 10.1109/TEMC.2024.3504879(Journal)
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Created: 2024-12-19 14:18:00
ConfID: 7741904
CauseID: 1661770594
OtherID: 1661770598
JT: IEEE Transactions on Electromagnetic Compatibility
MD: ,66,6,2,2024,IEEE Electromagnetic Compatibility Society Information
DOI: 10.1109/TEMC.2024.3504884(Journal) (7741904-N)
DOI: 10.1109/TEMC.2024.3504875(Journal)
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Created: 2024-12-19 14:18:00
ConfID: 7741905
CauseID: 1661770594
OtherID: 1661770598
JT: IEEE Transactions on Electromagnetic Compatibility
MD: ,66,6,3,2024,IEEE Transactions on Electromagnetic Compatibility Information for Authors
DOI: 10.1109/TEMC.2024.3504886(Journal) (7741905-N)
DOI: 10.1109/TEMC.2024.3504877(Journal)